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SGS5N60RUFD
April 2001
IGBT
SGS5N60RUFD
Short Circuit Rated IGBT
General Description
Fairchild's RUFD series of Insulated Gate Bipolar Transistors (IGBTs) provide low conduction and switching losses as well as short circuit ruggedness. The RUFD series is designed for applications such as motor control, uninterrupted power supplies (UPS) and general inverters where short circuit ruggedness is a required feature.
Features
* * * * * Short circuit rated 10us @ TC = 100C, VGE = 15V High speed switching Low saturation voltage : VCE(sat) = 2.2 V @ IC = 5A High input impedance CO-PAK, IGBT with FRD : trr = 37ns (typ.)
Application
AC & DC Motor controls, general purpose inverters, robotics, servo controls
C
G
GCE
TO-220F
TC = 25C unless otherwise noted
E
Absolute Maximum Ratings
Symbol VCES VGES IC ICM (1) TSC IF IFM PD TJ Tstg TL
Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current Collector Current Pulsed Collector Current Short Circuit Withstand Time Diode Continuous Forward Current Diode Maximum Forward Current Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Maximum Lead Temp. for soldering purposes, 1/8" from case for 5 seconds
@ TC = 25C @ TC = 100C @ TC = 100C @ TC = 100C @ TC = 25C @ TC = 100C
SGS5N60RUFD 600 20 8 5 15 10 8 56 35 14 -55 to +150 -55 to +150 300
Units V V A A A s A A W W C C C
Notes : (1) Repetitive rating : Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol RJC(IGBT) RJC(DIODE) RJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Typ. ---Max. 3.5 5.0 62.5 Units C/W C/W C/W
(c)2001 Fairchild Semiconductor Corporation
SGS5N60RUFD Rev. A
SGS5N60RUFD
Electrical Characteristics of IGBT T
Symbol Parameter
C
= 25C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Units
Off Characteristics
BVCES BVCES/ TJ ICES IGES Collector-Emitter Breakdown Voltage Temperature Coeff. of Breakdown Voltage Collector Cut-off Current G-E Leakage Current VGE = 0V, IC = 250uA VGE = 0V, IC = 1mA VCE = VCES, VGE = 0V VGE = VGES, VCE = 0V 600 ----0.6 ----250 100 V V/C A nA
On Characteristics
VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage IC = 5mA, VCE = VGE IC = 5A, VGE = 15V IC = 8A, VGE = 15V 5.0 --6.0 2.2 2.5 8.5 2.8 -V V V
Dynamic Characteristics
Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 30V, VGE = 0V, f = 1MHz ---354 67 14 ---pF pF pF
Switching Characteristics
td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Eon Eoff Ets Tsc Qg Qge Qgc Le Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Short Circuit Withstand Time Total Gate Charge Gate-Emitter Charge Gate-Collector Charge Internal Emitter Inductance --------------10 ----13 24 34 136 88 107 195 13 26 40 250 103 220 323 -16 3 7 7.5 --50 200 --280 --60 350 ----24 6 14 -ns ns nS ns J J J ns ns ns ns J J J s nC nC nC nH
VCC = 300 V, IC = 5A, RG = 40, VGE = 15V, Inductive Load, TC = 25C
VCC = 300 V, IC = 5A, RG = 40, VGE = 15V, Inductive Load, TC = 125C
@ TC =
VCC = 300 V, VGE = 15V 100C
VCE = 300 V, IC = 5A, VGE = 15V Measured 5mm from PKG
Electrical Characteristics of DIODE T
Symbol VFM trr Irr Qrr Parameter Diode Forward Voltage Diode Reverse Recovery Time Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge
C
= 25C unless otherwise noted
IF = 8A
Test Conditions TC = 25C TC = 100C TC = 25C TC = 100C
Min. ---------
Typ. 1.4 1.3 37 55 3.5 4.5 65 124
Max. 1.7 -55 -5.0 -138 --
Units V ns A nC
IF = 8A, di/dt = 200 A/s
TC = 25C TC = 100C TC = 25C TC = 100C
(c)2001 Fairchild Semiconductor Corporation
SGS5N60RUFD Rev. A
SGS5N60RUFD
25 Common Emitter T C = 25 20
20V
20
15V
Collector Current, I C [A]
15
Collector Current, IC [A]
16
Common Emitter V GE = 15V T C = 25 T C = 125 ------
12V
12
10 VGE = 10V 5
8
4
0 0 2 4 6 8
0 1 10
Collector - Emitter Voltage, VCE [V]
Collector - Emitter Voltage, V CE [V]
Fig 1. Typical Output Chacracteristics
Fig 2. Typical Saturation Voltage Characteristics
4.0
8
Common Emitter V GE = 15V
VCC = 300V Load Current : peak of square wave
Collector - Emitter Voltage, VCE [V]
3.5 10A
6
Load Current [A]
150
3.0
2.5 5A 2.0 IC = 3A 1.5
4
2 Duty cycle : 50% T C = 100 Power Dissipation = 9W 0.1 1 10 100 1000
1.0 -50 0 50 100
0
Case Temperature, TC []
Frequency [KHz]
Fig 3. Saturation Voltage vs. Case Temperature at Variant Current Level
Fig 4. Load Current vs. Frequency
20 Common Emitter T C = 25
20 Common Emitter T C = 125
Collector - Emitter Voltage, VCE [V]
16
Collector - Emitter Voltage, VCE [V]
16
12
12
8
8
4 IC = 3A 0 0 4 8
10A 5A
10A 4 IC = 3A 0 5A
12
16
20
0
4
8
12
16
20
Gate - Emitter Voltage, V GE [V]
Gate - Emitter Voltage, V GE [V]
Fig 5. Saturation Voltage vs. VGE
(c)2001 Fairchild Semiconductor Corporation
Fig 6. Saturation Voltage vs. VGE
SGS5N60RUFD Rev. A
SGS5N60RUFD
700 Common Emitter VGE = 0V, f = 1MHz TC = 25 100 Common Emitter VCC = 300V, V GE = 15V IC = 5A TC = 25 TC = 125 ------
600
Capacitance [pF]
400
Cies
Switching Time [ns]
500
Ton
Tr
300
200 Coes 100 Cres 0 1 10
10
10
100
Collector - Emitter Voltage, V CE [V]
Gate Resistance, R G [ ]
Fig 7. Capacitance Characteristics
Fig 8. Turn-On Characteristics vs. Gate Resistance
1000 Common Emitter VCC = 300V, V GE = 15V IC = 5A TC = 25 TC = 125 ------
Switching Time [ns]
Switching Loss [uJ]
Eoff Eon 100 Eoff
Toff Tf Toff
Tf 100 10 10 100 10
Common Emitter V CC = 300V, VGE = 15V IC = 5A T C = 25 T C = 125 -----100
Gate Resistance, R G [ ]
Gate Resistance, R G [ ]
Fig 9. Turn-Off Characteristics vs. Gate Resistance
Fig 10. Switching Loss vs. Gate Resistance
Common Emitter VGE = 15V, RG = 40 TC = 25 TC = 125 ------
1000
Common Emitter VGE = 15V, RG = 40 TC = 25 TC = 125 ------
Switching Time [ns]
100 Ton Tr
Switching Time [ns]
Tf
Toff
Toff Tf 100
10 3 4 5 6 7 8 9 10 3 4 5 6 7 8 9 10
Collector Current, IC [A]
Collector Current, IC [A]
Fig 11. Turn-On Characteristics vs. Collector Current
(c)2001 Fairchild Semiconductor Corporation
Fig 12. Turn-Off Characteristics vs. Collector Current
SGS5N60RUFD Rev. A
SGS5N60RUFD
1000 Common Emitter VGE = 15V, RG = 40 T C = 25 T C = 125 ------
15 Common Emitter RL = 60 T C = 25
Gate - Emitter Voltage, V [V] GE
12
300V 200V
Switching Loss [uJ]
9
VCC = 100V
Eoff 100 Eon
6
3
0
3
4
5
6
7
8
9
10
0
3
6
9
12
15
18
Collector Current, IC [A]
Gate Charge, Qg [nC]
Fig 13. Switching Loss vs. Collector Current
Fig 14. Gate Charge Characteristics
50 IC MAX. (Pulsed) 10 50us 100us 1 1 DC Operation IC MAX. (Continuous)
40
Collector Current, I C [A]
Collector Current, I C [A]
10
0.1
Single Nonrepetitive Pulse T C = 25 Curves must be derated linearly with increase in temperature 0.3 1 10 100 1000
0.01
1
1
Safe Operating Area VGE = 20V, TC = 100 10 100 1000
Collector-Emitter Voltage, V CE [V]
Collector-Emitter Voltage, VCE [V]
Fig 15. SOA Characteristic
Fig 16. Turn-Off SOA Characteristics
10
Thermal Response, Zthjc [/W]
0.5 1 0.2 0.1 0.05 0.1 0.02 0.01
Pdm t1 t2
single pulse 0.01 10
-5
Duty factor D = t1 / t2 Peak Tj = Pdm x Zthjc + TC
-4
10
10
-3
10
-2
10
-1
10
0
10
1
Rectangular Pulse Duration [sec]
Fig 17. Transient Thermal Impedance of IGBT
(c)2001 Fairchild Semiconductor Corporation SGS5N60RUFD Rev. A
SGS5N60RUFD
100 TC = 25 TC = 100 ------
100 VR = 200V IF = 8A TC = 25 TC = 100 ------
10
Reverse Recovery Current, I rr [A]
Forward Current, I F [A]
10
1
0.1 0 1 2 3
1 100 1000
Forward Voltage Drop, VF [V]
di/dt [A/us]
Fig 18. Forward Characteristics
Fig 19. Reverse Recovery Current
500
100 V R = 200V IF = 8A T C = 25 T C = 100 -----V R = 200V IF = 8A T C = 25 T C = 100 ------
Stored Recovery Charge, Qrr [nC]
Reverce Recovery Time, t rr [ns]
1000
400
80
300
60
200
40
100
20
0 100
0 100
1000
di/dt [A/us]
di/dt [A/us]
Fig 20. Stored Charge
Fig 21. Reverse Recovery Time
(c)2001 Fairchild Semiconductor Corporation
SGS5N60RUFD Rev. A
SGS5N60RUFD
Package Dimension
TO-220F (FS PKG CODE AQ)
3.30 0.10 10.16 0.20 (7.00) o3.18 0.10 2.54 0.20 (0.70)
6.68 0.20
15.80 0.20
(1.00x45)
MAX1.47 9.75 0.30 0.80 0.10
(3 ) 0
0.35 0.10 2.54TYP [2.54 0.20]
#1 0.50 -0.05 2.54TYP [2.54 0.20] 4.70 0.20
+0.10
2.76 0.20
9.40 0.20
Dimensions in Millimeters
(c)2001 Fairchild Semiconductor Corporation SGS5N60RUFD Rev. A
15.87 0.20
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM
DISCLAIMER
FAST(R) FASTrTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM
PACMANTM POPTM PowerTrench(R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SLIENT SWITCHER(R) SMART STARTTM Star* PowerTM StealthTM
SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM UltraFET(R) VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
(c)2001 Fairchild Semiconductor Corporation
Rev. H1

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